Views: 0 Author: Site Editor Publish Time: 2026-10-10 Origin: Site
GUANGZHOU, CHINA — MeetNENG , a dedicated designer and professional manufacturer of custom industrial computers and touch display solutions, is pleased to announce its participation in The 140th China Import and Export Fair (Canton Fair), taking place from October 15 to October 19, 2026, at the Canton Fair Complex in Guangzhou, China.
We warmly welcome international distributors, system integrators, solution providers, and automation engineers to visit our booth at Hall 17.2, Booth E17-E18. Attendees will have the opportunity to experience our rugged hardware innovations, discuss tailored OEM/ODM project requirements, and explore reliable computing architectures built for challenging industrial environments.
Event Name | The 140th Canton Fair (Phase 1) |
Date | October 15 – October 19, 2026 |
MeetNENG Booth No. | |
Venue | Canton Fair Complex (No. 382 Yuejiang Zhong Road, Haizhu District, Guangzhou, China) |
Exhibition Theme | Industrial Computer & Touch Display Solutions | Custom Industrial PC OEM/ODM |
At Booth Hall 17.2, E17-E18, MeetNENG will demonstrate an extensive portfolio of ruggedized computing platforms engineered specifically for factory automation, intelligent transportation, machine vision, and commercial interactive systems:
· Wide-Temperature Fanless Embedded Box PCs: Designed with heavy-duty aluminum heatsink chassis and efficient passive thermal dissipation, delivering reliable 24/7 continuous operation across harsh temperature ranges from -20°C to 70°C.
· IP65 Waterproof Front-Panel Touch Panel PCs: Featuring ruggedized industrial-grade touchscreens with IP65-rated front protection against dust, water ingress, and oil splashes, ideal for CNC machinery, food processing, and outdoor terminals.
· Smart Commercial & Industrial Interactive Terminals: Integrated multi-functional touch kiosk solutions and open-frame monitors offering seamless integration for smart logistics, retail kiosks, and MES manufacturing systems.
· Custom Industrial PC & Flexible OEM/ODM Capabilities: Full-lifecycle customization covering customized motherboard layouts, tailored chassis dimensions, versatile I/O expansion (multiple COM/RS485, dual/quad GbE LAN, GPIO, CAN bus), and specialized wide-voltage power modules.
· Direct Engineering Consultation: Discuss your application challenges directly with our hardware engineers and product specialists to identify the optimal computing platform.
· Live Product Demonstrations: Test real-time performance, rugged thermal endurance, responsive touch displays, and diverse modular expansion interfaces.
· Tailored OEM/ODM Co-Development: Review modular design options and custom branding capabilities to accelerate your product's time-to-market with competitive factory-direct pricing.
· Dedicated Channel & Distributor Support: Explore strategic partnership opportunities, localized distribution support, and stable long-term supply chain guarantees.
To ensure dedicated one-on-one technical discussion and personalized product demonstrations, we encourage you to book an appointment with our team prior to your arrival.
Booth Location | Hall 17.2, Booth E17-E18, Canton Fair Complex, Guangzhou |
Exhibition Dates | October 15–19, 2026 |
Online Pre-booking | Contact us through our website inquiry form or message our sales representative. |
We look forward to welcoming you in Guangzhou and establishing lasting partnerships at The 140th Canton Fair!
